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[Alpha Biz= Reporter Kim Jisun] Appsolix, the semiconductor glass substrate subsidiary of SKC, has been awarded $100 million (approximately 140 billion KRW) in research and development (R&D) grants from the U.S. government.

Selected for Advanced Packaging Program
On November 21, industry sources revealed that the U.S. Department of Commerce has designated the Appsolix Consortium as a beneficiary under the National Advanced Packaging Manufacturing Program (NAPMP), part of the CHIPS Act. This agreement solidifies the grant allocation.

Earlier, in May, Appsolix became the first company among global semiconductor material, component, and equipment firms to receive $75 million in production subsidies under the CHIPS Act.

The Appsolix Consortium reportedly includes prominent U.S.-based companies specializing in artificial intelligence (AI) and semiconductors, signaling collaboration across critical tech sectors. The grant reflects Appsolix’s technological leadership and is expected to accelerate the company's expansion in the U.S. market.

Appsolix is on the verge of commercializing the world’s first glass substrates, an innovation that replaces traditional plastic-based semiconductor substrates with glass. These substrates offer several advantages:

Reduced Thickness: Allows for slimmer and more compact devices.
Energy Efficiency: Cuts power consumption by over 30% compared to conventional plastic substrates.

This recognition underscores Appsolix’s competitive edge in cutting-edge semiconductor materials. The company is poised to play a pivotal role in the U.S. semiconductor ecosystem, which aims to enhance domestic manufacturing capabilities and reduce reliance on overseas supply chains.

 

 

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