Photo = SK hynix

 

[Alpha Biz= Reporter Kim Jisun] On the 4th, SK Hynix CEO Kwak No-jung announced that the company will supply samples of its next-generation high-bandwidth memory (HBM), the 48GB HBM3E 16-layer product, to clients early next year.

In his keynote speech at the "SK AI Summit 2024," Kwak stated, “With the market for 16-layer products expected to expand starting with HBM4, we are preparing by ensuring technical stability. We are currently developing the 48GB HBM3E 16-layer product and plan to provide samples to clients early next year.”

Kwak added, “The 16-layer product offers an 18% improvement in training performance and a 32% increase in inference performance compared to the 12-layer HBM3E. We have applied the advanced MR-MUF (Advanced Molded Underfill) process, already validated for mass production with the 12-layer, and are also developing next-generation packaging technology using hybrid bonding.”

SK Hynix reaffirmed its commitment to maintain a lead in HBM technology. Earlier, in March this year, it became the first in the industry to supply the 8-layer HBM3E, followed by the mass production of 12-layer HBM3E last month. The company also outlined its roadmap, planning to launch the 16-layer HBM3E in the first half of next year, HBM4 and HBM4E between 2025-2027, and HBM5 and HBM5E from 2028 to 2030.

 

 

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