Photo = Samsung Electronics

 

 

[Alpha Biz= Kim Jisun] Lin Jun-cheng, a former TSMC engineer and ex-Samsung Electronics executive, has reportedly left the company.

According to industry sources on Wednesday, Lin, who served as the executive in charge of the Next-Generation Research Lab at Samsung Electronics' Device Solutions (DS) division's CTO Semiconductor Research Institute, departed on December 31st, following the expiration of his two-year contract.

Lin is a semiconductor packaging expert who worked at TSMC from 1999 to 2017. Prior to joining Samsung Electronics, he served as the CEO of Taiwanese semiconductor equipment company Skytech. Samsung had recruited Lin in early 2023 to lead its newly established Advanced Packaging (AVP) organization, which focuses on the development of packaging technologies and products.

 

 

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