SK Hynix (photo = Yonhap news)

 

[Alpha Biz= Reporter Paul Lee] SK Hynix will invest 5.2 trillion won to build a next-generation high-bandwidth memory (HBM) production plant in Indiana, USA. With the goal of mass production in the second half of 2028, this is the first time that SK Hynix will build a production plant for HBM, the core of artificial intelligence (AI) semiconductors, overseas.

SK Hynix announced on the 4th that it will build an AI advanced packaging production base in West Lafayette, Indiana, USA, and cooperate in semiconductor research and development with local research institutes such as Purdue University.

It is the first time in the semiconductor industry to build an advanced packaging production base for AI in the United States. The company held an investment agreement ceremony with Indiana, Purdue, and US government officials at Purdue University on the 3rd (local time) and officially announced the plan.

 

 

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