View of Samsung Electro-Mechanics' Suwon plant. (Photo=Samsung Electro-Mechanics)

 

[Alpha Biz= Reporter Kim Sangjin] Samsung Electro-Mechanics has announced on the 22nd that it has successfully implemented advanced technology to integrate multiple semiconductor chips onto a single substrate through its collaboration with AMD. This high-performance substrate is crucial for CPU (central processing unit) and GPU (graphics processing unit) applications, offering significantly larger surface areas and more layers to enable the high-density interconnects required by modern data centers.

Compared to standard computer substrates, those used in data centers are ten times larger and have three times more layers. This requires efficient power delivery and reliability between chips. Samsung Electro-Mechanics has addressed issues like warping through innovative manufacturing processes, ensuring high yield during chip mounting.

The company's FCBGA (Flip-Chip Ball Grid Array) production line is equipped with real-time data collection and modeling capabilities, ensuring signal, power, and mechanical accuracy. Through this state-of-the-art facility, Samsung Electro-Mechanics leads in substrate production technology, meeting the future-oriented demands of next-generation data centers.

 

 

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