Photo = TSMC

 

[Alpha Biz= Reporter Kim Jisun] Taiwan's TSMC is building a semiconductor manufacturing plant in Germany, marking its first such facility in Europe as part of its strategy to expand its supply chain on the continent.

According to reports from Taiwan's Commercial Times and other foreign media on the 20th, ESMC, a joint venture between TSMC, Infineon, Bosch, and NXP, is set to hold a groundbreaking ceremony for the semiconductor plant in Dresden, Germany.

TSMC is expected to invest around €10 billion (approximately 14.7 trillion KRW) in the joint venture. The Dresden plant, scheduled to begin operations in 2027, will produce automotive semiconductors, with a projected monthly output of about 40,000 12-inch wafers.

Dresden is considered an optimal location for TSMC's automotive semiconductor production, given its proximity to automotive companies and wafer manufacturers.

The European Union (EU) aims to increase Europe's share of global semiconductor production to 20% by 2030 under its semiconductor law. The establishment of ESMC's plant in Germany is part of this initiative.

The Commercial Times predicts that since there are no advanced semiconductor manufacturing facilities with processes below 22nm in Europe, ESMC is likely to focus on producing semiconductors using processes below 7nm, especially with ASML, the exclusive producer of advanced semiconductor manufacturing equipment, located in Europe.

German Chancellor Olaf Scholz and TSMC Chairman Mark Liu are expected to attend the groundbreaking ceremony.

 

 

[ⓒ AlphaBIZ. 무단전재-재배포 금지]