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[Alpha Biz=(Chicago) Reporter Kim Jisun] Samsung Electronics recruited an engineer from Taiwan's TSMC, a foundry (semiconductor consignment production) company, as its vice president.

According to the Financial Supervisory Service's electronic disclosure system on the 8th, Samsung Electronics recently appointed Lin Jun-cheng, a former TSMC, as vice president of the Advanced Packaging (AVP) team in the semiconductor (DS) sector.

We are planning to develop advanced packaging technology in the future.

Vice President Lin worked for TSMC from 1999 to 2017 in semiconductor packaging. Since then, he has served as CEO of Skytech, a Taiwanese semiconductor equipment company.

Meanwhile, Samsung Electronics has stepped up the development of packaging-related technologies and products. Last year, Samsung Electronics created the 'Advanced Packaging Commercialization' Task Force (TF) team under the direct control of the president of DS. 

 

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