Kang Moon-soo, vice president of Samsung Electronics' AVP business team (사진= 삼성전자 제공)

[Alpha Biz=(Chicago) Reporter Kim Jisun] Earlier this year, Kang Moon-soo, vice president of Samsung Electronics' ambitious Advanced Package (AVP) business team, said he will focus on developing 2.5D and 3D packaging technologies.

"With the advent of the era of smartphones, mobile Internet, artificial intelligence (AI) and big data, the computing performance required is increasing rapidly," Vice President Kang posted a contribution to Samsung Electronics' newsroom on the 23rd. "However, the pace of progress and innovation of semiconductor technology has slowed compared to the past, and the refinement of the semiconductor process has reached physical limitations, which has slowed the increase in density."

Moore's Law, in which semiconductor density doubles every 24 months, has reached its limit. "To overcome these limitations of semiconductor technology, we need a new way to go beyond Moore's Law," Vice President Kang said. "We call this Beyond Moore."

In response, Samsung Electronics established an AVP business team in the DS division in December last year to strengthen advanced package technology and maximize synergy among business units. Recently, TSMC in Taiwan recruited Lin Juncheng, vice president of packaging.

In addition, Samsung Electronics Chairman Lee Jae-yong visited Samsung Electronics' Cheonan and Onyang operations on April 17 to check the competitiveness of next-generation semiconductor packages and research and development (R&D) capabilities.

 

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