[Alpha Biz=(Chicago) Reporter Paul Lee] Samsung Electronics has completed the development of packaging "iCube 8" that will be equipped with up to eight high-bandwidth memory (HBM) and will start mass production next year.

"How much logic and memory can be integrated in one package will be a competitive edge in semiconductor technology," said Kim Jong-kook, chairman of Samsung Electronics Group, at a semiconductor technology workshop held on the 8th. Samsung Electronics plans to complete performance tests on packaging basic technologies equipped with HBM 8s by the end of this year.

HBM is a memory that dramatically improves data processing speed by stacking DRAMs. It is considered a next-generation packaging technology due to its high level of memory stacking. It is classified as an essential element of high-performance computing (HPC) represented by artificial intelligence (AI), 5G, cloud, and data center applications.

Demand for high-capacity memory with fast computing speed is also increasing due to increased demand for generated AI and hyperscale data centers represented by ChatGPT. Samsung Electronics developed and mass-produced 'iCube 4', which implements four HBMs in one packaging in 2021. Following the completion of eight packaging developments, the company plans to develop packaging technologies with HBM 12s and 16 installations to lead the advanced packaging market.

 

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