[Alpha Biz=(Chicago) Reporter Kim Jisun] Hanmi Semiconductor is going to release next-generation high-bandwidth memory (HBM) equipment. HBM is a high-performance memory used for artificial intelligence (AI) and is a product that has recently seen a surge in demand along with graphics processing units (GPU).

Hanmi Semiconductor, a semiconductor post-process company, is prominent by entering the HBM process and developing next-generation equipment.

According to the industry on the 26th, Hanmi Semiconductor is developing a new equipment called 'New Dual TC Bonder'. It is currently in the final stage of development and is planned to be released as early as the second half of the year.

Hanmi Semiconductor is said to have succeeded in improving productivity and precision compared to the first generation currently being supplied to the market, applying the name "New Dual TC Bonder" in the sense of second-generation equipment. It is expected to be released in the second half.

 

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