[Alpha Biz=(Chicago) Reporter Kim Jisun] Samsung Electronics is going to supply high-bandwidth memory (HBM) and advanced packaging services, which are essential components of graphics processing units (GPU), to NVIDIA, a U.S. semiconductor company. Analysts say that NVIDIA has selected Samsung Electronics, which has both HBM manufacturing and advanced packaging capabilities to reduce its dependence on existing supplier TSMC and reduce production time and costs.

According to the semiconductor industry on the 1st, Samsung Electronics is currently verifying HBM3· advanced packaging service technology for NVIDIA and GPU. As soon as the technology verification process is completed, Samsung Electronics will supply HBM3s to NVIDIA and will be in charge of high-tech packaging that combines individual GPU chips and HBM3s and processes them into high-performance GPU "H100."

NVIDIA has entrusted most of its GPU advanced packaging to TSMC. TSMC packaged SK Hynix HBM3 in individual GPU chips manufactured through its process to produce NVIDIA's H100. However, with the recent proliferation of generative artificial intelligence (AI), demand for H100 has increased rapidly, making it difficult for TSMC to digest all orders from NVIDIA. Customers such as Microsoft said, "There is no CPU, so there is a problem with the service." NVIDIA has turned to Samsung Electronics, which has HBM3 and advanced packaging capabilities.

Samsung Electronics plans to strengthen its 'one-stop service', which is responsible for all semiconductor processes such as memory semiconductors, foundry (semiconductor consignment production), and advanced packaging, based on transactions with NVIDIA.

 

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