[Alpha Biz=(Chicago) Reporter Kim Jisun] SK Hynix succeeded in developing next-generation high-bandwidth memory (HBM) specialized in generative artificial intelligence (AI). It seems to be aiming for a rebound in performance with high-performance products in the midst of a semiconductor recession.

SK Hynix announced on the 21st that it succeeded in developing a new high-performance DRAM for AI, 'HBM3E'. We have also started supplying samples to our client, NVIDIA, for performance verification procedures. As soon as the verification is completed, it plans to start mass production in the first half of next year.

HBM is a high-performance product that innovatively increases data processing speed by connecting several DRAMs vertically. It is being developed in the order of first generation (HBM)-2nd generation (HBM2)-3rd generation (HBM2E)-4th generation (HBM3)-5th generation (HBM3E).

SK Hynix developed the world's first fourth-generation product, HBM3, in 2021. According to market researcher TrendForce, SK Hynix ranks first in the global HBM market with a market share of 50%.

The newly developed HBM3E can handle up to 1.15 terabytes (TB) of data per second. This is equivalent to processing more than 230 full-HD movies in one second.

 

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