[Alpha Biz=(Chicago) Reporter Kim Jisun] Samsung Electronics will execute a Super-Gap Strategy in next-generation high-bandwidth memory(HBM).

According to the coverage of AlphaBiz, Samsung Electronics recently decided to mass-produce HBM4, the next-generation HBM, by 2025.
The company will use hybrid bonding technology in HBM4 mass-production.

According to the industry, Samsung's archrival TSMC has already adopted Hybrid bonding technology

For the matter, Samsung Electronics commented, "we are moving toward the plan, but we have not been finalized it."

 

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