[Apha Biz=(Chicago) Reporter Paul Lee] SKC announced on November 11 that it will take part in attracting Series B investment from Chipletz, a US semiconductor packaging startup, and secure a 12% stake.

SKC plans to accelerate the global expansion of the semiconductor post-process business through this investment. SKC's investment amount will not be disclosed due to an agreement between the two companies.

Semiconductor packaging is a post-process that organically connects chips with different functions such as central processing units (CPUs) and DRAMs. According to SKC, the process is emerging as a key factor in determining the performance of chipsets.

Chipletz was launched in 2016 as an in-house venture (CIC) of AMD, a global semiconductor company, and spun off in 2021. AMD and Taiwan's ASE, the world's No. 1 semiconductor post-process outsourcing company (OSAT), are chiplets shareholders.

Through this investment, SKC will build a global partnership in chiplets and semiconductor packaging.

 

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