[Apha Biz=(Chicago) Reporter Paul Lee] Hanmi Semiconductor made an announcement on the 4th that it has won an order for the third-generation "Dual TC Bonder Griffin" from SK Hynix for about 60 billion won, which is a next-generation HBM (high-bandwidth memory) essential process equipment for artificial intelligence (AI) semiconductors.

It is the largest single contract in history. Hanmi Semiconductor also won the TC Bond for HBM for 41.6 billion won on the 1st of last month.

HBM is one of the next-generation memory semiconductors specialized in high-performance AI operations. To produce a HBM, you need a TC bonder that can attach multiple DRAMs by thermal compression. Hanmi Semiconductor has been developing and producing TC bonds since 2016-2017.

Stock industry sources estimate that Hanmi Semiconductor will record sales of KRW 54.4 billion and operating profit of KRW 15 billion in the third quarter, respectively. As the semiconductor industry, which is a front-line industry, continues to deteriorate, it is predicted that it will record a rather sluggish report card. The company expects sales to improve significantly next year if additional orders from overseas customers for new TC bonder equipment are added.

 

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