[Alpha Biz=(Chicago) Reporter Kim Jisun] YEST announced on the 27th that it has won a part of the second volume of 'HBM (High Bandwidth Memory) Manufacturing Pressure Equipment' worth 12.3 billion won to a global semiconductor company.

This order is twice as large as last month's initial volume and is the largest ever for semiconductor equipment.

As the remaining second orders are scheduled soon, YEST has already secured the largest-ever orders for equipment for HBM by the first half of next year. The company explained that large-scale orders are expected to continue in the second half of next year depending on the progress of HBM investment by customers.

The equipment supplied by YEST is a wafer pressurization facility that is applied to the 'underfeel' stage, one of the core processes of HBM. Underfill is a process to prevent Warpage of HBMs stacked with multiple DRAMs. It uses insulating materials to harden them evenly, removing impurities as well as maintaining balance between chips. It is a key process for performance optimization of HBM.

 

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