[Alpha Biz=(Chicago) Reporter Kim Jisun] Samsung Electronics will invest 360 billion won in Yokohama, Japan, to establish a semiconductor packaging R & D base. Half of the investment is subsidized by the Japanese government.

According to industry sources, Samsung Electronics has decided to establish a semiconductor R & D facility in the Minatomirai district on the coast of Yokohama. About 100 technicians are employed here.

Samsung Electronics is expected to deal with semiconductor packaging technology, which has emerged as a hot topic in the industry. As the heterogeneous combination that connects multiple chips as one has become a trend in the industry, the company is working hard to apply this technology to the memory and foundry business.

Samsung's new facility investment is 40 billion yen (about 363 billion won). The Japanese government is considering subsidizing 20 billion yen (about 180 billion won), about half of its investment. It is heard that joint research with Japanese research institutes is also being discussed.

 

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