[Alpha Biz=(Chicago) Reporter Kim Jisun] SK Hynix is considering establishing a semiconductor packaging plant in Indiana, USA.

According to the Financial Times (FT) on the 1st, SK Hynix plans to build a semiconductor packaging plant in Indiana. Packaging is a process of connecting the integrated circuit to the outside and controlling heat.

The HBM produced by SK Hynix is used in NVIDIA's graphics processing unit (GPU) in the United States. Meanwhile, SK Hynix has been producing HBM in Korea. Since then, TSMC in Taiwan has installed HBM on NVIDIA GPU along with its manufacturing processor.

Insiders and outsiders of the industry believe that once SK Hynix's Indiana plant is established, NVIDIA will be able to procure parts in the U.S. While TSMC is building two plants in Arizona, if SK Hynix produces HBM in the U.S., it will be able to make artificial intelligence (AI) chips with parts produced in the U.S.

 

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