[Alpha Biz=(Chicago) Reporter Paul Lee] Semiconductor equipment maker Hanmi Semiconductor made an announcement on the 2nd that it has won an order for "Dual TC Bond the Griffin," a third-generation hypermodel of artificial intelligence semiconductor high bandwidth memory (HBM), from SK Hynix, the largest scale of its foundation on a single basis

Hanmi Semiconductor has won a cumulative order of 187.2 billion won from the second half of last year to the present as a dual TC bonder for HBM.

Founded in 1980, Hanmi Semiconductor participated in the "2024 Semicon Korea Exhibition" at COEX in Samseong-dong, Gangnam-gu, Seoul, and is promoting its global market share equipment "7th Generation New Microso & Vision Place 6.0 Griffin" and HBM essential process equipment Dual TC Bonder, which are scheduled to be released in the first half of this year.

 

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