Photo = SK hynix

 

[Alpha Biz= Reporter Kim Jisun] SK Hynix will receive up to 620 billion KRW (approximately $450 million) in direct subsidies from the U.S. Department of Commerce for its semiconductor packaging production facility investment in Indiana. The U.S. Department of Commerce announced on August 6th that it signed a Preliminary Memorandum of Terms (PMT) with SK Hynix to provide federal subsidies for the establishment of advanced packaging manufacturing and R&D facilities for high-bandwidth memory (HBM).

Under the PMT, in addition to the direct funding, SK Hynix will receive $500 million in loan support from the U.S. government. Furthermore, the U.S. Treasury Department will offer tax credits of up to 25% of SK Hynix's investment in the U.S.

The final subsidy agreement will be confirmed following the established procedures of the Semiconductor Act's incentive program. The direct subsidy ratio relative to SK Hynix's investment is 11.6%, higher than that of Taiwan's TSMC (10.2%) and Intel (8.5%). By comparison, Samsung Electronics' advanced semiconductor plant in Texas, with an investment of $45 billion, will receive $6.4 billion in subsidies, representing a 14.2% subsidy-to-investment ratio.

 

 

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