Samsung Electronics Seocho office (photo = Yonhap news)

 

[Alpha Biz=(Chicago) Reporter Kim Jisun] Samsung Electronics refuted reports that it will introduce SK Hynix technology to HBM (High Bandwidth Memory) on the 13th, saying, "It is not true."

Reuters reported on the 13th that Samsung Electronics purchased related manufacturing equipment to introduce SK Hynix's 'MR-MUF' process.

SK Hynix is said to be one step ahead in the recent high-tech HBM war, which is cited as the reason for its own "MR-MUF (Mass Reflow Molded Underfill)" technology.

In the case of Samsung Electronics, NCF (non-conductive adhesive film) process is adopted for HBM production.

"NCF technology developed by Samsung Electronics attaches a chip while laying a film-type material every time it is stacked, and it has been evaluated that it is difficult to solve the bending phenomenon with 12-layer products."

Samsung Electronics said, "It is clearly not true," and stressed, "We are making enough optimal solutions in the NCF method." ．

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