Samsung Electronics Seocho office (photo = Yonhap news)

 

[Alpha Biz= Reporter Kim Jisun] Samsung Electronics succeeded in implementing a new technology that stacks high-bandwidth memory (HBM). It is an advanced packaging technology called 'hybrid bonding', and the first application of the next-generation HBM 16 HBM4 is expected.

"We have recently confirmed that the 16-layer HBM is working normally," said Kim Dae-woo, executive vice president of Samsung Electronics' advanced packaging (AVP) business team, in a keynote speech at the 2024 regular conference of the Korea Micro Electronics and Packaging Society (KMEPS) on the 3rd. "We tested it with HBM3, but we will soon move on to HBM4 and prepare for mass production."

Samsung Electronics' technology development was carried out with HBM3, but it is noteworthy that all 16 layers to be implemented in HBM4 are stacked with hybrid bonding. It is estimated that it has secured core technologies for commercialization of HBM4.

 

 

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