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SK Hynix Achieves 70% Yield in HBM4 Testing, Signaling Strong Market Position

Business / Kim Jisun / 02/27/2025 03:15 AM

Photo = SK Hynix

 

 

[Alpha Biz= Kim Jisun] SK Hynix has reportedly improved the test yield of its sixth-generation high-bandwidth memory (HBM4) to 70%, marking significant progress in the pre-mass production evaluation phase. Industry watchers are closely monitoring whether SK Hynix can secure a dominant position in the HBM4 market.


According to industry sources on Wednesday, SK Hynix recently achieved a 70% yield in its 12-layer HBM4 testing. Yield refers to the percentage of functional semiconductor chips and is a crucial factor in business competitiveness.


An industry insider familiar with the matter stated, "HBM4 test yields surpassed 60% late last year, and they have improved even further recently," adding, "The company is increasing its test yield at a remarkable pace."

Test yield serves as an indicator of potential mass production efficiency. Higher test yields increase the likelihood of stable and productive large-scale manufacturing. An industry expert commented, "A 70% test yield is an excellent result, especially considering that yields typically improve further after mass production begins."


SK Hynix has reportedly set high manufacturing standards for its HBM4 12-layer technology, targeting yield improvements with reliability standards in the high 90% range. Additionally, the company has integrated its fifth-generation 10nm-class DRAM, known as "1b," into HBM4 12-layer products. This DRAM was also used in HBM3E, and its proven performance and stability have likely contributed to yield stabilization.


Previously, SK Hynix announced that its HBM3E yield had reached the target 80%, cutting the time required for mass production by 50%. Given this precedent, HBM4 12-layer products are also expected to transition to mass production quickly. The process involves completing internal development and evaluation, supplying samples, passing customer qualification tests, and then commencing full-scale manufacturing.


HBM4 12-layer memory is expected to be integrated into NVIDIA's next-generation AI accelerator, the "Rubin" series. While Rubin was initially slated for mass production next year, industry speculation suggests the timeline may be accelerated, with production potentially beginning as early as the second half of this year.



 

AlphaBIZ Kim Jisun(stockmk2020@alphabiz.co.kr)

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