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[Alpha Biz=(Chicago) Reporter Kim Jisun] SK Hynix will expand its 'High Bandwidth Memory (HBM)' production line. In response to the growing demand for artificial intelligence (AI) semiconductors, the company is considering doubling its production capacity of HBM, an essential memory.
According to industries on the 15th, SK Hynix has begun preparing to invest in post-process facilities to increase HBM3 shipments. The main goal is to expand the Icheon plant, which packs HBM3.
An industry official familiar with the issue said, "We are preparing to introduce additional equipment around the post-process line, which plays an important role in HBM 3 production." It is heard that the size of post-process facilities will nearly double by the end of the year.
HBM is a high-performance memory that stacks multiple DRAMs vertically and significantly improves data processing speed compared to conventional DRAMs. Because multiple memories need to be packaged as if they were a single semiconductor, the number of post-process equipment, or packaging facilities, needs to be increased to expand HBM production capacity. This is the background of adding facilities to the Icheon plant where HBM packaging takes place.
This expansion is aimed at responding to HBM demand due to AI market growth. HBM is applied to high-performance computing (HPC) for AI processing, along with CPU·GPU in large data centers. Demand for HBM memory is increasing at the same time as AI semiconductors due to performance specialized in large-scale data processing. In particular, HBM3 is a popular product in the high-bandwidth memory market, and SK Hynix is trying to expand production around HBM3.
AlphaBIZ 김지선(stockmk2020@alphabiz.co.kr)
