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[Alpha Biz=(Chicago) Reporter Kim Jisun] Semiconductor equipment company Hanmi Semiconductor unveiled its SAW equipment "Full Automation Wafer Micro So" at the "2023 Semicon China" on the 29th.
After succeeding in its first localization with the launch of the dualchuck microso in June 2021, Hanmi Semiconductor released the microso, tape microso and glass microso for the jumbo PCB. Wafer Micro So is the sixth So model released by Hanmi Semiconductor.
Following its participation in Semicon China in Shanghai as an official sponsor, Hanmi Semiconductor will also participate as an official sponsor in "2023 Semicon Taiwan" to be held in Taipei, Taiwan, in September to launch global marketing.
Hanmi Semiconductor is also supplying dual TC bonders for Through Silicon Via (TSV) method high bandwidth memory (HBM) production essential process equipment. It is attracting attention as a key equipment for AI semiconductor for generative artificial intelligence (AI) service represented by ChatGPT.
AlphaBIZ 김지선(stockmk2020@alphabiz.co.kr)
